Non-Contact Tin Removal
Utilizing high-precision weight sensors and high-pressure gas assistance, noncontact solder removal is achieved, minimizing the risk of BGA damage or padabrasion during the desoldering process. The system also supports rapid generationof solder removal paths without the need for Gerber files.
Large-Field High-Resolution CCD Visual System
Equipped with a 5-megapixel top camera and a 12-megapixel bottom camera, theresolution is 0.015mm/pixel with a field of view of 39mm x 29mm for the topcamera and 0.015mm/pixel with a 49mm x 37mm field of view for the bottomcamera. The system uses proprietary control software and algorithms, ensuringhigh alignment accuracy and a high degree of automation. For the same PCB andcomponent positions, only the initial alignment is needed; subsequent repairs canbe performed with a single-click rework.
Four Independent Preheating Platforms
The device features four independent preheating and heating platforms: an upperde-soldering platform, an upper solder removal platform, a lower heating platformand a mobile temperature zone. Each platform is equipped with a heating andtemperature control system, and all heating/preheating platforms and solderemoval heads use closed-loop temperature control for stable and accurate overaltemperature regulation
Safety Assurance
Strict standards are in place to ensure the yield of products and the safetyof operators. The device is equipped with a secondary light curtain forsafety, and each heating module has individual secondary protection. Thedownward pressing module is equipped with a weight sensor, and aldoors are fitted with limit switches. Alarms are triggered in case ofoverheating, personnel entering the work area, or exceeding positionlimits.
