3D CT X-ray Inspection Machine

Seamark XPT8200 is a high-resolution 3D X-ray fluoroscopic inspection system featuring an open-tube design. It supports a variety of CT imaging modes, including standard cone-beam CT (CBCT), standard cone-beam extended field-of-view CT, and helical (spiral) CT scanning. Designed for versatility, it is ideal for applications in industrial manufacturing, quality control and process optimization, electronic components, and semiconductor/chip inspection, meeting the rigorous inspection requirements for samples of various sizes and materials.

Seamark XCT8000 is a desktop small industrial CT/3D X-ray inspection equipment designed specifically for small-sized samples. lt is easy to install and move, suitable for laboratory analysis and on-site use.The machine is equipped with self-developed professional software, supporting 360 degree inspection from any angle, with aspatial resolution of 5um and an optimal defect resolution of 3um.It can be used for quality inspection, 3D measurement, and non-destructive analysis. With qualitative and quantitative analysis software, it can accurately capture the microscopic characteristics inside the sample, achieve multi angle measurement and analysis and empower product quality inspection.

Seamark AX19000 is a high-speed CT-based X-ray fully automatic inspectionsystem, equipped with innovative self-developed intelligent inspectionsoftware, enabling high-speed 3D inspection. lt can inspect a widerange of components, including BGA, POP, LGA, QFP, CSP, CHIP, QFN, DIPinserted components, lGBT, and more. lt is capable of detecting defectssuch as missing components,misalignment, solder bridging, opensolder joints, insufficient solder, voids, pillow effect, and other issues.

Seamark XCT8500 is an offline industrial CT/3D X-ray inspection system. ltfeatures a COMET open-type X-ray tube design and is equippedwith innovative self-developed intelligent Inspection software aswell as professional CT analysis and visualization software. ltoffers 360-degree arbitrary angle inspection with defectInspection capabilities down to less than 1um. The system issuitable for quality inspection, 3D measurement, and non-destructive analysis. It is capable of characterizing micro-scalefeatures of a sample’s internal structure and, combined withqualitative and quantitative analysis software, enables multi-angle measurement and analysis of samples, providing effectivedata for product quality inspection.